Philips TEA6845H (QFP 64) solder flakes

• Main Authors: Fio, Julius, Sia, George, Yutuc, Rico, Cuasay, Mar, Dacones, Jean, Aquino, Delia, Limin, Bobette, Limos, RJ, Carencia, Enrico, Olviga, Jeffrey, Isidro, Reynante, Macarubbo, Roehl M.
• Format: text
• Published: Animo Repository 2004
• Subjects: Solder and soldering; Failure analysis (Engineering); Operations Research, Systems Engineering and Industrial Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/8335
• Institution: De La Salle University