Philips TEA6845H (QFP 64) solder flakes
Saved in:
Main Authors: | Fio, Julius, Sia, George, Yutuc, Rico, Cuasay, Mar, Dacones, Jean, Aquino, Delia, Limin, Bobette, Limos, RJ, Carencia, Enrico, Olviga, Jeffrey, Isidro, Reynante, Macarubbo, Roehl M. |
---|---|
Format: | text |
Published: |
Animo Repository
2004
|
Subjects: | |
Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/8335 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | De La Salle University |
Similar Items
-
Manufacture of cored solder wire and soldering ribbons
by: Ampil, Eduardo G.
Published: (1960) -
Determination of dragout rates of solderon acid in the plating cell by tank analysis method
by: Antonio, Bernadeth S.
Published: (1997) -
Correlation between intermetallic thickness and roughness during solder reflow
by: Zuruzi, A.S., et al.
Published: (2014) -
A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
by: ZHAO BING
Published: (2010) -
Development of Lead-Free Nanocomposite Solders for Electronic Packaging
by: PAYMAN BABAGHORBANI
Published: (2010)