Optimization of the chemical mechanical polishing process for optical silicon substrates

• المؤلفون الرئيسيون: Zhong, Z. W., Tian, Y. B., Ang, Y. J., Wu, H.
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/100176; http://hdl.handle.net/10220/13586

Chemical mechanical polishing (CMP) experiments are performed to study the effects of four key process factors on the flatness and surface finish of the polished optical silicon substrates and on the material removal rate (MRR). The experimental results and analyses reveal that the pad rotational sp...