Optimization of the chemical mechanical polishing process for optical silicon substrates

Optimization of the chemical mechanical polishing process for optical silicon substrates

Chemical mechanical polishing (CMP) experiments are performed to study the effects of four key process factors on the flatness and surface finish of the polished optical silicon substrates and on the material removal rate (MRR). The experimental results and analyses reveal that the pad rotational sp...

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書目詳細資料
Main Authors:	Zhong, Z. W., Tian, Y. B., Ang, Y. J., Wu, H.
其他作者:	School of Mechanical and Aerospace Engineering
格式:	Article
語言:	English
出版:	2013
在線閱讀:	https://hdl.handle.net/10356/100176 http://hdl.handle.net/10220/13586
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University
語言:	English

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