Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect

Various annealing conditions (environment, temperature, and duration) are applied to study the nanoscale Kirkendall effect of copper (Cu) nanowire (NW) arrays on a Si substrate. The results show that an appropriate amount of oxygen supply is crucial for uniform transformation from Cu NWs (average di...

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Main Authors: Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2014
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Online Access:https://hdl.handle.net/10356/102276
http://hdl.handle.net/10220/19022
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1022762020-06-01T10:13:49Z Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect Chun, Shu Rong Sasangka, Wardhana Aji Ng, Mei Zhen Liu, Qing Du, Anyan Zhu, Jie Ng, Chee Mang Liu, Zhi Qiang Chiam, Sing Yang Gan, Chee Lip School of Materials Science & Engineering Temasek Laboratories DRNTU::Engineering::Materials::Nanostructured materials Various annealing conditions (environment, temperature, and duration) are applied to study the nanoscale Kirkendall effect of copper (Cu) nanowire (NW) arrays on a Si substrate. The results show that an appropriate amount of oxygen supply is crucial for uniform transformation from Cu NWs (average diameter ∼50 nm) into Cu oxide nanotube arrays. An annealing duration of 30 min at 200 °C in a low vacuum environment reveals that the voids are not uniformly distributed at the Cu/Cu oxide interface. This suggests that void growth is due to surface diffusion of Cu along void surfaces. Annealing above 200 °C for 60 min resulted in complete transformation from Cu NWs into Cu oxide nanotubes. X-ray photoelectron spectroscopy characterization indicates that the Cu oxides formed at 200 °C and 300 °C are Cu2O and CuO, respectively. It is demonstrated that the transformation from Cu NW arrays into Cu oxide nanotube arrays can be combined with the joining of stacked Si chips in a single-process step with reasonable joint shear strength. Transmission electron microscopy-electron energy loss spectroscopy elemental mapping analysis reveals that the joint interface is Cu oxide. The outward diffusion of Cu driven by the nanoscale Kirkendall effect is believed to enhance the joining process. By controlling the environment, temperature, and duration, joined Cu2O or CuO nanotube stacked chips can be achieved, which serve as a platform for the further development of nanostructured, stacked devices. 2014-03-28T06:05:19Z 2019-12-06T20:52:31Z 2014-03-28T06:05:19Z 2019-12-06T20:52:31Z 2013 2013 Journal Article Chun, S. R., Sasangka, W. A., Ng, M. Z., Liu, Q., Du, A., Zhu, J., Ng, C. M., et al. (2013). Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect. Small, 9(15), 2546-2552. 1613-6810 https://hdl.handle.net/10356/102276 http://hdl.handle.net/10220/19022 10.1002/smll.201202533 en Small © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Nanostructured materials
spellingShingle DRNTU::Engineering::Materials::Nanostructured materials
Chun, Shu Rong
Sasangka, Wardhana Aji
Ng, Mei Zhen
Liu, Qing
Du, Anyan
Zhu, Jie
Ng, Chee Mang
Liu, Zhi Qiang
Chiam, Sing Yang
Gan, Chee Lip
Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
description Various annealing conditions (environment, temperature, and duration) are applied to study the nanoscale Kirkendall effect of copper (Cu) nanowire (NW) arrays on a Si substrate. The results show that an appropriate amount of oxygen supply is crucial for uniform transformation from Cu NWs (average diameter ∼50 nm) into Cu oxide nanotube arrays. An annealing duration of 30 min at 200 °C in a low vacuum environment reveals that the voids are not uniformly distributed at the Cu/Cu oxide interface. This suggests that void growth is due to surface diffusion of Cu along void surfaces. Annealing above 200 °C for 60 min resulted in complete transformation from Cu NWs into Cu oxide nanotubes. X-ray photoelectron spectroscopy characterization indicates that the Cu oxides formed at 200 °C and 300 °C are Cu2O and CuO, respectively. It is demonstrated that the transformation from Cu NW arrays into Cu oxide nanotube arrays can be combined with the joining of stacked Si chips in a single-process step with reasonable joint shear strength. Transmission electron microscopy-electron energy loss spectroscopy elemental mapping analysis reveals that the joint interface is Cu oxide. The outward diffusion of Cu driven by the nanoscale Kirkendall effect is believed to enhance the joining process. By controlling the environment, temperature, and duration, joined Cu2O or CuO nanotube stacked chips can be achieved, which serve as a platform for the further development of nanostructured, stacked devices.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Chun, Shu Rong
Sasangka, Wardhana Aji
Ng, Mei Zhen
Liu, Qing
Du, Anyan
Zhu, Jie
Ng, Chee Mang
Liu, Zhi Qiang
Chiam, Sing Yang
Gan, Chee Lip
format Article
author Chun, Shu Rong
Sasangka, Wardhana Aji
Ng, Mei Zhen
Liu, Qing
Du, Anyan
Zhu, Jie
Ng, Chee Mang
Liu, Zhi Qiang
Chiam, Sing Yang
Gan, Chee Lip
author_sort Chun, Shu Rong
title Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
title_short Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
title_full Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
title_fullStr Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
title_full_unstemmed Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect
title_sort joining copper oxide nanotube arrays driven by the nanoscale kirkendall effect
publishDate 2014
url https://hdl.handle.net/10356/102276
http://hdl.handle.net/10220/19022
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