Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling

In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished...

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Main Authors: Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2013
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Online Access:https://hdl.handle.net/10356/102285
http://hdl.handle.net/10220/16866
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1022852020-03-07T12:47:12Z Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming School of Electrical and Electronic Engineering A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from −40 °C to +125 °C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and as-soldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles. 2013-10-25T01:33:23Z 2019-12-06T20:52:39Z 2013-10-25T01:33:23Z 2019-12-06T20:52:39Z 2012 2012 Journal Article Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling. Intermetallics, 31, 72-78. 0966-9795 https://hdl.handle.net/10356/102285 http://hdl.handle.net/10220/16866 10.1016/j.intermet.2012.06.002 en Intermetallics
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
description In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from −40 °C to +125 °C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and as-soldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
format Article
author Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
author_sort Nai, S. M. L.
title Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
title_short Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
title_full Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
title_fullStr Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
title_full_unstemmed Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
title_sort interfacial reaction and shear strength of ni-coated carbon nanotubes reinforced sn–ag–cu solder joints during thermal cycling
publishDate 2013
url https://hdl.handle.net/10356/102285
http://hdl.handle.net/10220/16866
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