Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling

• المؤلفون الرئيسيون: Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/102285; http://hdl.handle.net/10220/16866

In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished...