Design of simultaneous bi-directional transceivers utilizing capacitive coupling for 3DICs in face-to-face configuration

Capacitive-coupling-based simultaneously bi-directional transceivers for chip-to-chip communication in three-dimensional integrated circuits are presented. By employing a 4-level signaling strategy with a novel cascaded capacitor configuration, the proposed transceivers can transmit and receive data...

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Bibliographic Details
Main Authors: Aung, Myat Thu Linn, Lim, Eric, Yoshikawa, Takefumi, Kim, Tony Tae-Hyoung
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/102585
http://hdl.handle.net/10220/16384
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Institution: Nanyang Technological University
Language: English

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