Design of simultaneous bi-directional transceivers utilizing capacitive coupling for 3DICs in face-to-face configuration
Capacitive-coupling-based simultaneously bi-directional transceivers for chip-to-chip communication in three-dimensional integrated circuits are presented. By employing a 4-level signaling strategy with a novel cascaded capacitor configuration, the proposed transceivers can transmit and receive data...
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Main Authors: | Aung, Myat Thu Linn, Lim, Eric, Yoshikawa, Takefumi, Kim, Tony Tae-Hyoung |
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其他作者: | School of Electrical and Electronic Engineering |
格式: | Article |
語言: | English |
出版: |
2013
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主題: | |
在線閱讀: | https://hdl.handle.net/10356/102585 http://hdl.handle.net/10220/16384 |
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