Transient liquid phase Ag-based solder technology for high-temperature packaging applications

• المؤلفون الرئيسيون: Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Materials::Metallic materials::Alloys
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/102603; http://hdl.handle.net/10220/24294

A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded...