Transient liquid phase Ag-based solder technology for high-temperature packaging applications

• Main Authors: Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Metallic materials::Alloys
• Online Access: https://hdl.handle.net/10356/102603; http://hdl.handle.net/10220/24294
• Institution: Nanyang Technological University

A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded...