Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

To address the reliability challenges brought by the accelerated reaction with the implementation of lead-free solders, an electrolessly plated Ni-Co-P alloy (3~4 wt.% P and 9~12 wt.% Co) was developed as the solder metallization in this study. Three compounds layers, (Ni,Co)3Sn4, (Ni,Co)3P and (Ni,...

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Bibliographic Details
Main Authors: Yang, Ying, Huang, Yizhong, Liu, Hai, Chen, Zhong, Balaraju, J. N.
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2014
Subjects:
Online Access:https://hdl.handle.net/10356/104531
http://hdl.handle.net/10220/20248
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Institution: Nanyang Technological University
Language: English
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