A low-profile three-dimensional neural probe array using a silicon lead transfer structure
This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes an...
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sg-ntu-dr.10356-1057052020-06-01T10:13:52Z A low-profile three-dimensional neural probe array using a silicon lead transfer structure Cheng, Ming-Yuan Je, Minkyu Tan, Kwan Ling Tan, Ee Lim Lim, Ruiqi Yao, Lei Li, Peng Park, Woo-Tae Phua, Eric Jian Rong Gan, Chee Lip Yu, Aibin School of Materials Science & Engineering DRNTU::Engineering::Materials This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 µm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed. ASTAR (Agency for Sci., Tech. and Research, S’pore) 2013-11-29T03:58:52Z 2019-12-06T21:56:12Z 2013-11-29T03:58:52Z 2019-12-06T21:56:12Z 2013 2013 Journal Article Cheng, M.-Y., Je, M., Tan, K. L., Tan, E. L., Lim, R., Yao, L., et al. (2013). A low-profile three-dimensional neural probe array using a silicon lead transfer structure. Journal of micromechanics and microengineering, 23(9), 095013. https://hdl.handle.net/10356/105705 http://hdl.handle.net/10220/17904 10.1088/0960-1317/23/9/095013 en Journal of micromechanics and microengineering |
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DRNTU::Engineering::Materials Cheng, Ming-Yuan Je, Minkyu Tan, Kwan Ling Tan, Ee Lim Lim, Ruiqi Yao, Lei Li, Peng Park, Woo-Tae Phua, Eric Jian Rong Gan, Chee Lip Yu, Aibin A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
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This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes—the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 µm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed. |
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School of Materials Science & Engineering |
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School of Materials Science & Engineering Cheng, Ming-Yuan Je, Minkyu Tan, Kwan Ling Tan, Ee Lim Lim, Ruiqi Yao, Lei Li, Peng Park, Woo-Tae Phua, Eric Jian Rong Gan, Chee Lip Yu, Aibin |
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Article |
author |
Cheng, Ming-Yuan Je, Minkyu Tan, Kwan Ling Tan, Ee Lim Lim, Ruiqi Yao, Lei Li, Peng Park, Woo-Tae Phua, Eric Jian Rong Gan, Chee Lip Yu, Aibin |
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Cheng, Ming-Yuan |
title |
A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
title_short |
A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
title_full |
A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
title_fullStr |
A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
title_full_unstemmed |
A low-profile three-dimensional neural probe array using a silicon lead transfer structure |
title_sort |
low-profile three-dimensional neural probe array using a silicon lead transfer structure |
publishDate |
2013 |
url |
https://hdl.handle.net/10356/105705 http://hdl.handle.net/10220/17904 |
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1681059397517705216 |