3D simulation-based research on the effect of interconnect structures on circuit reliability

• Main Authors: He, Feifei, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
• Online Access: https://hdl.handle.net/10356/107007; http://hdl.handle.net/10220/25292; http://www.worldacademicunion.com/journal/1746-7233WJMS/wjmsvol08no04paper03.pdf
• Institution: Nanyang Technological University

Electromigration (EM) of the interconnects is a key factor in determining the reliability of an integrated circuit, especially for the present-day IC with shrinking interconnect dimension. The simulation of the EM reliability of the interconnects is usually performed using the line-via structure at...