Statistical modeling of via redundancy effects on interconnect reliability

• Main Authors: Tan, Cher Ming, Raghavan, Nagarajan
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: https://hdl.handle.net/10356/90793; http://hdl.handle.net/10220/6345
• Institution: Nanyang Technological University

Electromigration is an important failure mechanism in the nano-interconnects of modern IC technology. Various approaches have been investigated to prolong the lifetime of an interconnect. One such approach i...