Statistical modeling of via redundancy effects on interconnect reliability
Electromigration is an important failure mechanism in the nano-interconnects of modern IC technology. Various approaches have been investigated to prolong the lifetime of an interconnect. One such approach i...
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المؤلفون الرئيسيون: | , |
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مؤلفون آخرون: | |
التنسيق: | Conference or Workshop Item |
اللغة: | English |
منشور في: |
2010
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الموضوعات: | |
الوصول للمادة أونلاين: | https://hdl.handle.net/10356/90793 http://hdl.handle.net/10220/6345 |
الوسوم: |
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المؤسسة: | Nanyang Technological University |
اللغة: | English |
الملخص: | Electromigration is an important failure mechanism in
the nano-interconnects of modern IC technology. Various
approaches have been investigated to prolong the lifetime of an
interconnect. One such approach is to have an in-built redundancy
in the via structures of the interconnect. The presence of
redundant via in a parallel topology helps improve the overall
reliability of the via structure. Although reliability improvement
due to via redundancy is qualitatively understood, it is necessary to
quantify the improvement in reliability through statistical models
so that the improvement in lifetime as a result of redundancy can
be quantified. A statistical model that incorporates the effects of
redundancy is developed in this study and it is used to estimate the
reliability of redundant via structures. The Cumulative Damage
Model (CDM) is used in conjunction with the Maximum
Likelihood Estimate (MLE) method to assess the reliability of load
sharing via redundant structures in this study. |
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