Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer

A scalable method to fabricate germanium on insulator (GOI) substrate through epitaxy, bonding, and layer transfer is reported. The germanium (Ge) epitaxial film is grown directly on a silicon (Si) (001) donor wafer using a “three-step growth” approach in a reduced pressure chemical vapour depositio...

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Bibliographic Details
Main Authors: Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2015
Subjects:
Online Access:https://hdl.handle.net/10356/107093
http://hdl.handle.net/10220/25327
http://dx.doi.org/10.1063/1.4895487
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Institution: Nanyang Technological University
Language: English