Fabrication of high aspect-ratio polysilicon microstructures for microsystem techonology applications

by Chong, Gang Yih.
Published 2008

Advanced wafer bonding for substrate engineering and 3D IC integration

by Chong, Gang Yih
Published 2014

AlN-AlN layer bonding and it's thermal characteristics

by Shuyu, Bao, Lee, Kwang Hong, Chong, Gang Yih, Fitzgerald, Eugene A., Tan, Chuan Seng
Published 2015

AlN-AlN wafer bonding and its thermal characteristics

by Bao, Shunyu, Lee, Kwang Hong, Chong, Gang Yih, Fitzgerald, Eugene A, Tan, Chuan Seng
Published 2015

Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient

by Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng
Published 2015

Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer

by Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng
Published 2015

3D geometric engineering of the double wedge-like electrodes for filament-type RRAM device performance improvement

by Sun, Jianxun, Li, Yuanbo, Ye, Yiyang, Zhang, Jun, Chong, Gang Yih, Tan, Juan Boon, Liu, Zhen, Chen, Tupei
Published 2021