Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer
A scalable method to fabricate germanium on insulator (GOI) substrate through epitaxy, bonding, and layer transfer is reported. The germanium (Ge) epitaxial film is grown directly on a silicon (Si) (001) donor wafer using a “three-step growth” approach in a reduced pressure chemical vapour depositio...
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Main Authors: | , , , , , |
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格式: | Article |
語言: | English |
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2015
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在線閱讀: | https://hdl.handle.net/10356/107093 http://hdl.handle.net/10220/25327 http://dx.doi.org/10.1063/1.4895487 |
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