Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer

A scalable method to fabricate germanium on insulator (GOI) substrate through epitaxy, bonding, and layer transfer is reported. The germanium (Ge) epitaxial film is grown directly on a silicon (Si) (001) donor wafer using a “three-step growth” approach in a reduced pressure chemical vapour depositio...

全面介紹

Saved in:
書目詳細資料
Main Authors: Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng
其他作者: School of Electrical and Electronic Engineering
格式: Article
語言:English
出版: 2015
主題:
在線閱讀:https://hdl.handle.net/10356/107093
http://hdl.handle.net/10220/25327
http://dx.doi.org/10.1063/1.4895487
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!