A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory
This paper explores the scalability of in-plane and perpendicular MTJ based STT-MRAMs from 65 nm to 8 nm while taking into consideration realistic variability effects. We focus on the read and write performances of a STT-MRAM based cache rather than the obvious advantages such as the denser bit-cell...
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sg-ntu-dr.10356-1071552019-12-06T22:25:47Z A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory Chun, Ki Chul Zhao, Hui Harms, Jonathan D. Kim, Tony Tae-Hyoung Wang, Jian-Ping Kim, Chris H. School of Electrical and Electronic Engineering School of Mechanical and Aerospace Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits This paper explores the scalability of in-plane and perpendicular MTJ based STT-MRAMs from 65 nm to 8 nm while taking into consideration realistic variability effects. We focus on the read and write performances of a STT-MRAM based cache rather than the obvious advantages such as the denser bit-cell and zero static power. An accurate MTJ macromodel capturing key MTJ properties was adopted for efficient Monte Carlo simulations. For the simulation of access devices and peripheral circuitries, ITRS projected transistor parameters were utilized and calibrated using the MASTAR tool that has been widely used in industry. 6T SRAM and STT-MRAM arrays were implemented with aggressive assist schemes to mimic industrial memory designs. A constant JC0·RA/VDD scaling scenario was used which to the first order gives the optimal balance between read and write margins of STT-MRAMs. The thermal stability factor ensuring a 10 year retention time was obtained by adjusting the free layer thickness as well as assuming improvement in the crystalline anisotropy. Our studies based on the proposed scaling methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material in order to overcome the poor write performance scaling from 22 nm node onwards. 2013-12-04T08:57:15Z 2019-12-06T22:25:47Z 2013-12-04T08:57:15Z 2019-12-06T22:25:47Z 2013 2013 Journal Article Chun, K. C., Zhao, H., Harms, J. D., Kim, T.-H., Wang, J.-P., & Kim, C. H. (2013). A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory. IEEE journal of solid-state circuits, 48(2), 598-610. https://hdl.handle.net/10356/107155 http://hdl.handle.net/10220/18037 http://dx.doi.org/10.1109/JSSC.2012.2224256 en IEEE journal of solid-state circuits |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits Chun, Ki Chul Zhao, Hui Harms, Jonathan D. Kim, Tony Tae-Hyoung Wang, Jian-Ping Kim, Chris H. A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
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This paper explores the scalability of in-plane and perpendicular MTJ based STT-MRAMs from 65 nm to 8 nm while taking into consideration realistic variability effects. We focus on the read and write performances of a STT-MRAM based cache rather than the obvious advantages such as the denser bit-cell and zero static power. An accurate MTJ macromodel capturing key MTJ properties was adopted for efficient Monte Carlo simulations. For the simulation of access devices and peripheral circuitries, ITRS projected transistor parameters were utilized and calibrated using the MASTAR tool that has been widely used in industry. 6T SRAM and STT-MRAM arrays were implemented with aggressive assist schemes to mimic industrial memory designs. A constant JC0·RA/VDD scaling scenario was used which to the first order gives the optimal balance between read and write margins of STT-MRAMs. The thermal stability factor ensuring a 10 year retention time was obtained by adjusting the free layer thickness as well as assuming improvement in the crystalline anisotropy. Our studies based on the proposed scaling methodology show that in-plane STT-MRAM will outperform SRAM from 15 nm node, while its perpendicular counterpart requires further innovations in MTJ material in order to overcome the poor write performance scaling from 22 nm node onwards. |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Chun, Ki Chul Zhao, Hui Harms, Jonathan D. Kim, Tony Tae-Hyoung Wang, Jian-Ping Kim, Chris H. |
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Article |
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Chun, Ki Chul Zhao, Hui Harms, Jonathan D. Kim, Tony Tae-Hyoung Wang, Jian-Ping Kim, Chris H. |
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Chun, Ki Chul |
title |
A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
title_short |
A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
title_full |
A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
title_fullStr |
A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
title_full_unstemmed |
A scaling roadmap and performance evaluation of in-plane and perpendicular MTJ based STT-MRAMs for high-density cache memory |
title_sort |
scaling roadmap and performance evaluation of in-plane and perpendicular mtj based stt-mrams for high-density cache memory |
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2013 |
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https://hdl.handle.net/10356/107155 http://hdl.handle.net/10220/18037 http://dx.doi.org/10.1109/JSSC.2012.2224256 |
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1681037813596815360 |