Chemo-thermo-viscoelastic characterization and material modeling of electronic packaging moulding compound materials

• المؤلف الرئيسي: Neo, Raynard Guan Hock
• مؤلفون آخرون: Yi Sung
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging; DRNTU::Engineering::Materials::Material testing and characterization
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13494
• المؤسسة: Nanyang Technological University

Highly filled epoxy moulding compounds are widely used for the encapsulation of microelectronic chips today. As thermo-rheological behaviour of these thermosetting materials is complex, the material characteristics must be determined by experiments and described by mathematical models so that a bett...