Resistive RAM endurance : array-level characterization and correction techniques targeting deep learning applications
Limited endurance of resistive RAM (RRAM) is a major challenge for future computing systems. Using thorough endurance tests that incorporate fine-grained read operations at the array level, we quantify for the first time temporary write failures (TWFs) caused by intrinsic RRAM cycle-to-cycle and cel...
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Main Authors: | , , , , , , , , , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2020
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/143255 |
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Institution: | Nanyang Technological University |
Language: | English |
Summary: | Limited endurance of resistive RAM (RRAM) is a major challenge for future computing systems. Using thorough endurance tests that incorporate fine-grained read operations at the array level, we quantify for the first time temporary write failures (TWFs) caused by intrinsic RRAM cycle-to-cycle and cell-to-cell variations. We also quantify permanent write failures (PWFs) caused by irreversible breakdown/dissolution of the conductive filament. We show how technology-, RRAM programing-, and system resilience-level solutions can be effectively combined to design new generations of energy-efficient computing systems that can successfully run deep learning (and other machine learning) applications despite TWFs and PWFs. We analyze corresponding system lifetimes and TWF bit error ratio. |
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