Uniform delayering of copper metallization

Uniform delayering of copper metallization

Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization remova...

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Bibliographic Details
Main Authors: Siah, Yu Wen, Hong, Y. J., Liu, Q., Kor, Katherine Hwee Boon, Gan, C. L.
Other Authors: School of Materials Science and Engineering
Format: Conference or Workshop Item
Language:English
Published: 2020
Subjects:
Engineering::Materials
Delayering
Sample Preparation
Online Access:https://hdl.handle.net/10356/143510
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Institution: Nanyang Technological University
Language: English
Description
Summary:Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization removal while reducing edge rounding on the sample during sample preparation that will preserve the integrity of the layers for further failure analysis.

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