Uniform delayering of copper metallization

• Main Authors: Siah, Yu Wen, Hong, Y. J., Liu, Q., Kor, Katherine Hwee Boon, Gan, C. L.
• 其他作者: School of Materials Science and Engineering
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2020
• 主題: Engineering::Materials; Delayering; Sample Preparation
• 在線閱讀: https://hdl.handle.net/10356/143510

Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization remova...