Bonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metal

• المؤلفون الرئيسيون: Yan, Guangxu, Bhowmik, Ayan, Nagarajan, Balasubramanian, Song, Xu, Tan, Sung Chyn, Tan, Ming Jen
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2021
• الموضوعات: Engineering::Mechanical engineering; Bonding Temperature; Microstructure and Mechanical Properties
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/151524

Transient liquid phase (TLP) bonding of Inconel 718 with BNi-2 filler metal has traditionally been carried out using thin filler metal (narrow gap) to achieve complete eutectic-free isothermal solidification layer joints. However, for the aerospace components with relatively large cracks or worn are...