Bonding temperature effects on the wide gap transient liquid phase bonding of Inconel 718 using BNi-2 paste filler metal

• Main Authors: Yan, Guangxu, Bhowmik, Ayan, Nagarajan, Balasubramanian, Song, Xu, Tan, Sung Chyn, Tan, Ming Jen
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Mechanical engineering; Bonding Temperature; Microstructure and Mechanical Properties
• Online Access: https://hdl.handle.net/10356/151524
• Institution: Nanyang Technological University

Transient liquid phase (TLP) bonding of Inconel 718 with BNi-2 filler metal has traditionally been carried out using thin filler metal (narrow gap) to achieve complete eutectic-free isothermal solidification layer joints. However, for the aerospace components with relatively large cracks or worn are...