Advanced packaging solder paste

• Main Author: Zhuang, Guanqing
• Other Authors: Long Yi
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2022
• Subjects: Engineering::Materials
• Online Access: https://hdl.handle.net/10356/157587
• Institution: Nanyang Technological University

Electronic devices are becoming smaller in size and more chip functions are being integrated into even smaller package systems. The market is also increasingly demanding fine powders for soldering processes. But the continuing trend towards compact size and 3D integrated modules is further inc...