Advanced packaging solder paste

Electronic devices are becoming smaller in size and more chip functions are being integrated into even smaller package systems. The market is also increasingly demanding fine powders for soldering processes. But the continuing trend towards compact size and 3D integrated modules is further inc...

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Bibliographic Details
Main Author: Zhuang, Guanqing
Other Authors: Long Yi
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/157587
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Institution: Nanyang Technological University
Language: English

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