Measurement and error analysis of Cu film thickness with Ta barrier layer on wafer for CMP application

• Main Authors: Qu, Zilian, Wang, Wensong, Li, Xueli, Li, Qi, Zheng, Yuanjin
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Electrical and electronic engineering; Chemical Mechanical Polishing; Eddy Current Based Measurement System
• 在線閱讀: https://hdl.handle.net/10356/159502
• 機構: Nanyang Technological University

Accurate thickness measurement of copper (Cu) film on silicon (Si)-based wafers is very important in the chemical mechanical polishing (CMP) process. For thickness measurement of Cu film, the eddy current method is widely adopted due to noncontact, high-efficiency, and high-accuracy characteristics....