Active ultrahigh-Q (0.2 × 10⁶) THz topological cavities on a chip

Rapid scaling of semiconductor devices has led to an increase in the number of processor cores and integrated functionalities onto a single chip to support the growing demands of high-speed and large-volume consumer electronics. To meet this burgeoning demand, an improved interconnect capacity in te...

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Bibliographic Details
Main Authors: Kumar, Abhishek, Gupta, Manoj, Pitchappa, Prakash, Tan, Thomas CaiWei, Chattopadhyay, Udvas, Ducournau, Guillaume, Wang, Nan, Chong, Yidong, Singh, Ranjan
Other Authors: School of Physical and Mathematical Sciences
Format: Article
Language:English
Published: 2023
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Online Access:https://hdl.handle.net/10356/165327
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Institution: Nanyang Technological University
Language: English
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