Active ultrahigh-Q (0.2 × 10⁶) THz topological cavities on a chip
Rapid scaling of semiconductor devices has led to an increase in the number of processor cores and integrated functionalities onto a single chip to support the growing demands of high-speed and large-volume consumer electronics. To meet this burgeoning demand, an improved interconnect capacity in te...
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Main Authors: | , , , , , , , , |
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格式: | Article |
語言: | English |
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2023
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在線閱讀: | https://hdl.handle.net/10356/165327 |
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