Some thermal mismatch problems in electronic devices

• Main Author: Fazrul Fazmi
• Other Authors: Xiao Zhongmin
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Mechanical engineering::Mechatronics
• Online Access: http://hdl.handle.net/10356/16614
• Institution: Nanyang Technological University

Electronic devices consist of multiple layers of different materials having different coefficient of thermal expansion (CTE). During processing, the high operating temperature induces thermal stress on the interface of the different layer as well as thermally-induced bending of the structure due to...