Stress analysis for crack problems due to thermal mismatch

Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon i...

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Bibliographic Details
Main Author: Hoe, Florina Suyi.
Other Authors: Xiao Zhongmin
Format: Final Year Project
Language:English
Published: 2012
Subjects:
Online Access:http://hdl.handle.net/10356/49353
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Institution: Nanyang Technological University
Language: English