Stress analysis for crack problems due to thermal mismatch
Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon i...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2012
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| Online Access: | http://hdl.handle.net/10356/49353 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon integrated circuits. The processes of deposition and lithography in the manufacturing process have to take into account of the problems posed by the presence of defects such as micro cracks. |
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