Stress analysis for crack problems due to thermal mismatch

Stress analysis for crack problems due to thermal mismatch

Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon i...

Full description

Saved in:
Bibliographic Details
Main Author: Hoe, Florina Suyi.
Other Authors: Xiao Zhongmin
Format: Final Year Project
Language:English
Published: 2012
Subjects:
DRNTU::Engineering::Mechanical engineering
Online Access:http://hdl.handle.net/10356/49353
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-49353
record_format dspace
spelling sg-ntu-dr.10356-493532023-03-04T19:20:38Z Stress analysis for crack problems due to thermal mismatch Hoe, Florina Suyi. Xiao Zhongmin School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon integrated circuits. The processes of deposition and lithography in the manufacturing process have to take into account of the problems posed by the presence of defects such as micro cracks. Bachelor of Engineering (Mechanical Engineering) 2012-05-17T09:04:17Z 2012-05-17T09:04:17Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/49353 en Nanyang Technological University 77 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Hoe, Florina Suyi.
Stress analysis for crack problems due to thermal mismatch
description Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon integrated circuits. The processes of deposition and lithography in the manufacturing process have to take into account of the problems posed by the presence of defects such as micro cracks.
author2 Xiao Zhongmin
author_facet Xiao Zhongmin
Hoe, Florina Suyi.
format Final Year Project
author Hoe, Florina Suyi.
author_sort Hoe, Florina Suyi.
title Stress analysis for crack problems due to thermal mismatch
title_short Stress analysis for crack problems due to thermal mismatch
title_full Stress analysis for crack problems due to thermal mismatch
title_fullStr Stress analysis for crack problems due to thermal mismatch
title_full_unstemmed Stress analysis for crack problems due to thermal mismatch
title_sort stress analysis for crack problems due to thermal mismatch
publishDate 2012
url http://hdl.handle.net/10356/49353
_version_ 1759853650170085376

Similar Items