Stress analysis for crack problems due to thermal mismatch

• Main Author: Hoe, Florina Suyi.
• Other Authors: Xiao Zhongmin
• Format: Final Year Project
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/49353
• Institution: Nanyang Technological University

Microelectromechanical Systems (MEMS) fabrication process encounts many engineering challenges in the manufacturing industry. With the rapid advancement of technology, it is inevitable that there is a greater demand for MEMS products. In MEMS fabrications procedures, the key components are silicon i...