Mitigation of corner polysilicon residues through nitride liner etch relocation

• 主要作者: Zheng, Zhe
• 其他作者: Wang Hong
• 格式: Thesis-Master by Coursework
• 語言: English
• 出版: Nanyang Technological University 2023
• 主題: Engineering::Electrical and electronic engineering
• 在線閱讀: https://hdl.handle.net/10356/166578

NAND flash memory has grown enormously and becomes the most popular non-volatile SSD (Solid State Drives). After 2D NAND reaches its limit, the 3D structure has become the mainstream of NAND. 3D NAND increases capacity in a given footprint without an excessive shrinking of the flash memory chips to...