Effects of residual stresses on the stiffness of MEMS structures

• Main Author: See, Sau Fong.
• Other Authors: Ong Lin Seng
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
• Online Access: http://hdl.handle.net/10356/16854
• Institution: Nanyang Technological University

In inertial sensor applications a thermocompression bond is often used for die attachment in hermetic, vacuum packages. These bonds are made by heating the ceramic chip carrier and the MEMS sensor die to ~325°C, bonding the components, and cooling to ambient conditions. Due to mismatch in thermal ex...