Effects of residual stresses on the stiffness of MEMS structures

• 主要作者: See, Sau Fong.
• 其他作者: Ong Lin Seng
• 格式: Final Year Project
• 語言: English
• 出版: 2009
• 主題: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
• 在線閱讀: http://hdl.handle.net/10356/16854
• 機構: Nanyang Technological University

In inertial sensor applications a thermocompression bond is often used for die attachment in hermetic, vacuum packages. These bonds are made by heating the ceramic chip carrier and the MEMS sensor die to ~325°C, bonding the components, and cooling to ambient conditions. Due to mismatch in thermal ex...