Effects of residual stresses on the stiffness of MEMS structures

In inertial sensor applications a thermocompression bond is often used for die attachment in hermetic, vacuum packages. These bonds are made by heating the ceramic chip carrier and the MEMS sensor die to ~325°C, bonding the components, and cooling to ambient conditions. Due to mismatch in thermal ex...

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Bibliographic Details
Main Author: See, Sau Fong.
Other Authors: Ong Lin Seng
Format: Final Year Project
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/16854
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Institution: Nanyang Technological University
Language: English
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