Effects of residual stresses on the stiffness of MEMS structures

• المؤلف الرئيسي: See, Sau Fong.
• مؤلفون آخرون: Ong Lin Seng
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/16854
• المؤسسة: Nanyang Technological University

In inertial sensor applications a thermocompression bond is often used for die attachment in hermetic, vacuum packages. These bonds are made by heating the ceramic chip carrier and the MEMS sensor die to ~325°C, bonding the components, and cooling to ambient conditions. Due to mismatch in thermal ex...