327 Gbps THz silicon photonic interconnect with sub-λ bends

327 Gbps THz silicon photonic interconnect with sub-λ bends

Miniaturized photonic devices at the terahertz (THz) band are envisioned to bring significant enhancement to data transfer capacity and integration density for computing and future wireless communications. Broadband silicon waveguiding technology has continuously matured to advance low-loss platform...

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Bibliographic Details
Main Authors: Gupta, Manoj, Navaratna, Nikhil, Szriftgiser, Pascal, Ducournau, Guillaume, Singh, Ranjan
Other Authors: School of Physical and Mathematical Sciences
Format: Article
Language:English
Published: 2023
Subjects:
Physics
Photonic Devices
Terahertz Band
Online Access:https://hdl.handle.net/10356/171386
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Institution: Nanyang Technological University
Language: English

Internet

https://hdl.handle.net/10356/171386

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