327 Gbps THz silicon photonic interconnect with sub-λ bends

• Main Authors: Gupta, Manoj, Navaratna, Nikhil, Szriftgiser, Pascal, Ducournau, Guillaume, Singh, Ranjan
• Other Authors: School of Physical and Mathematical Sciences
• Format: Article
• Language: English
• Published: 2023
• Subjects: Physics; Photonic Devices; Terahertz Band
• Online Access: https://hdl.handle.net/10356/171386
• Institution: Nanyang Technological University

Miniaturized photonic devices at the terahertz (THz) band are envisioned to bring significant enhancement to data transfer capacity and integration density for computing and future wireless communications. Broadband silicon waveguiding technology has continuously matured to advance low-loss platform...