2D super-resolution metrology based on superoscillatory light

Progress in the semiconductor industry relies on the development of increasingly compact devices consisting of complex geometries made from diverse materials. Precise, label-free, and real-time metrology is needed for the characterization and quality control of such structures in both scientific res...

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Bibliographic Details
Main Authors: Wang, Yu, Chan, Eng Aik, Rendón-Barraza, Carolina, Shen, Yijie, Plum, Eric, Ou, Jun-Yu
Other Authors: School of Physical and Mathematical Sciences
Format: Article
Language:English
Published: 2024
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Online Access:https://hdl.handle.net/10356/181362
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Institution: Nanyang Technological University
Language: English
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Summary:Progress in the semiconductor industry relies on the development of increasingly compact devices consisting of complex geometries made from diverse materials. Precise, label-free, and real-time metrology is needed for the characterization and quality control of such structures in both scientific research and industry. However, optical metrology of 2D sub-wavelength structures with nanometer resolution remains a major challenge. Here, a single-shot and label-free optical metrology approach that determines 2D features of nanostructures, is introduced. Accurate experimental measurements with a random statistical error of 18 nm (λ/27) are demonstrated, while simulations suggest that 6 nm (λ/81) may be possible. This is far beyond the diffraction limit that affects conventional metrology. This metrology employs neural network processing of images of the 2D nano-objects interacting with a phase singularity of the incident topologically structured superoscillatory light. A comparison between conventional and topologically structured illuminations shows that the presence of a singularity with a giant phase gradient substantially improves the retrieval of object information in such an optical metrology. This non-invasive nano-metrology opens a range of application opportunities for smart manufacturing processes, quality control, and advanced materials characterization.