Applications and precision studies of positive photoresists in photolithography

• Main Author: Li, Yichen
• Other Authors: Lee Seok Woo
• Format: Thesis-Master by Coursework
• Language: English
• Published: Nanyang Technological University 2025
• Subjects: Chemistry; Engineering; Photoresists; Photolithography
• Online Access: https://hdl.handle.net/10356/182653
• Institution: Nanyang Technological University

This paper reviews the evolution of photolithography, from its origins with Senefelder to modern technologies such as EUV, DUV, and EBL. Photolithography, a complex multidisciplinary field, has continually advanced, with core factors influencing resolution improvement identified through the study of these techniques. Despite repetitive core technologies, understanding their differences and underlying principles is essential for further progress. As the demand for miniaturization drives nanotechnology, overcoming resolution limits in photolithography remains crucial. Optimizing photoresist resolution while maintaining process stability and throughput is key, especially in semiconductor manufacturing. This study focuses on optimizing photolithography parameters to achieve high-resolution patterning for micro- and nanofabrication applications. Through experiments on key steps like spin coating, soft bake, exposure, and development, the paper highlights the importance of precise process control and demonstrates the potential for enhancing positive photoresist performance.