Indentation cracking and acoustic emission generation in silicon

This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and mo...

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Bibliographic Details
Main Author: Ong, Woon Eng.
Other Authors: School of Applied Science
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19349
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Institution: Nanyang Technological University
Language: English
Description
Summary:This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and more pronounced radial cracks. The presence of a indentation size effect was also found when calculating the fracture toughness as a function of the indentation load and radial crack length.