Indentation cracking and acoustic emission generation in silicon
This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and mo...
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Format: | Theses and Dissertations |
Language: | English |
Published: |
2009
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Online Access: | http://hdl.handle.net/10356/19349 |
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Institution: | Nanyang Technological University |
Language: | English |
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