Indentation cracking and acoustic emission generation in silicon

Indentation cracking and acoustic emission generation in silicon

This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and mo...

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Main Author: Ong, Woon Eng.
Other Authors: School of Applied Science
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
DRNTU::Engineering::Materials
Online Access:http://hdl.handle.net/10356/19349
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-193492020-09-27T20:16:53Z Indentation cracking and acoustic emission generation in silicon Ong, Woon Eng. School of Applied Science Widjaja Susanto Manoharan Mohan DRNTU::Engineering::Materials This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and more pronounced radial cracks. The presence of a indentation size effect was also found when calculating the fracture toughness as a function of the indentation load and radial crack length. Master of Applied Science 2009-12-11T00:49:41Z 2009-12-11T00:49:41Z 2000 2000 Thesis http://hdl.handle.net/10356/19349 en 89 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Ong, Woon Eng.
Indentation cracking and acoustic emission generation in silicon
description This thesis is a summary of research work on the indentation fracture of silicon wafers. Crack formation on silicon and its fracture toughness were studied using single indentation at different loads. It is shown that indentations made at higher loads are more likely to produce lateral cracks and more pronounced radial cracks. The presence of a indentation size effect was also found when calculating the fracture toughness as a function of the indentation load and radial crack length.
author2 School of Applied Science
author_facet School of Applied Science
Ong, Woon Eng.
format Theses and Dissertations
author Ong, Woon Eng.
author_sort Ong, Woon Eng.
title Indentation cracking and acoustic emission generation in silicon
title_short Indentation cracking and acoustic emission generation in silicon
title_full Indentation cracking and acoustic emission generation in silicon
title_fullStr Indentation cracking and acoustic emission generation in silicon
title_full_unstemmed Indentation cracking and acoustic emission generation in silicon
title_sort indentation cracking and acoustic emission generation in silicon
publishDate 2009
url http://hdl.handle.net/10356/19349
_version_ 1681058299991031808

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