Machine-vision guided underfill dispense system for direct chip attach electronics packages

The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.

Saved in:
Bibliographic Details
Main Author: Wong, Jordan How Tho.
Other Authors: Seet, Gerald Gim Lee
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19909
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.