Machine-vision guided underfill dispense system for direct chip attach electronics packages
The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author.
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| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19909 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-199092023-03-11T17:06:43Z Machine-vision guided underfill dispense system for direct chip attach electronics packages Wong, Jordan How Tho. Seet, Gerald Gim Lee School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author. Master of Science (Precision Engineering) 2009-12-14T07:07:57Z 2009-12-14T07:07:57Z 1998 1998 Thesis http://hdl.handle.net/10356/19909 en NANYANG TECHNOLOGICAL UNIVERSITY 113 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Manufacturing |
| spellingShingle |
DRNTU::Engineering::Manufacturing Wong, Jordan How Tho. Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| description |
The Jetski production was initiated to make pagers that contained high valued-added components. The processes of assembling the components into the pagers adopted the Direct Chip Attach or Flip Chip technique. One of the processes, known as underfill operation, was designed by the author. |
| author2 |
Seet, Gerald Gim Lee |
| author_facet |
Seet, Gerald Gim Lee Wong, Jordan How Tho. |
| format |
Theses and Dissertations |
| author |
Wong, Jordan How Tho. |
| author_sort |
Wong, Jordan How Tho. |
| title |
Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| title_short |
Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| title_full |
Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| title_fullStr |
Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| title_full_unstemmed |
Machine-vision guided underfill dispense system for direct chip attach electronics packages |
| title_sort |
machine-vision guided underfill dispense system for direct chip attach electronics packages |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/19909 |
| _version_ |
1761781988293869568 |